Research & Development

Consulting Services

  • Finite Element Analysis *
  • Highly Accelerated Life Testing
  • Material Characterization
  • Thermal Cycling
  • Shock Impact
  • Vibration Analysis
  • Modal Analysis
  • Prognosis of Electronics
  • Low cycle fatigue and fracture
  • Failure Analysis


We provide reliable solutions to industry and Research and Development Organizations for reliability of electronic packages consisting of solder alloys, BGAs, printed circuit boards subjected to shock, vibration and temperature cycling.

The domain area of expertise is in micro-electronics, automotive electronics and concentrated photovoltaics.



*  More Details about Finite Element Analysis

Undertake Industry, R&D and Academic Projects Software Training Courses to Industry & Academia Non-linear, creep, fatigue, buckling, crack growth, etc. FEA simulations

Computer Aided Engineering

Interconnect Fatigue

  • Temperature Cycling
  • High strain rate material characterization
  • Vibration(High cycle fatigue)
  • Shock fracture and low cycle fatigue


  • Material Composition
  • Interaction with interface metals
  • Brittle fracture
  • Creep Rupture

Printed Wiring Board

  • Surface Finish
  • PWB Manufacturing defects
  • Materials

Application Areas

Mode Shapes


Vibration Load


Thermal Load

Shock Load - FEA

Tension Test - Crack (FEA)

Event Registration